IEEE - Institute of Electrical and Electronics Engineers, Inc. - Chip-to-chip communication based on capacitive coupling

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Cardu, R. ; Scandiuzzo, M. ; Cani, S. ; Perugini, L. ; Franchi, E. ; Canegallo, R. ; Guerrieri, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 6
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306549
Regular:

This paper presents a review of the solutions proposed for chip-to-chip communication based on capacitive coupling. Circuit designs, assembly options and various different test cases are presented... View More

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