IEEE - Institute of Electrical and Electronics Engineers, Inc. - System-level comparison of power delivery design for 2D and 3D ICs

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Khan, N.H. ; Alam, S.M. ; Hassoun, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 7
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306539
Regular:

Three-dimensional integrated circuits (IC) promise high bandwidth, low latency, low device power, and a small form factor. Increased device density and asymmetrical packaging, however, render 3D... View More

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