IEEE - Institute of Electrical and Electronics Engineers, Inc. - 3D on-chip memory for the vector architecture

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Funaya, Y. ; Egawa, R. ; Takizawa, H. ; Kobayashi, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 6
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306537
Regular:

Vector supercomputers play an important roll in a high performance computing area because vector systems can achieve a high computational efficiency for large scale scientific applications. The... View More

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