IEEE - Institute of Electrical and Electronics Engineers, Inc. - 3D TSV processes and its assembly/packaging technology

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Seung Wook Yoon ; Dae Wook Yang ; Jae Hoon Koo ; Padmanathan, M. ; Carson, F.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 5
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306535
Regular:

Demand for Through Silicon Via (TSV) is being driven by the need for 3D stacking to shorten interconnection length, increase signal speed, reduce power consumption and reduce power dissipation.... View More

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