IEEE - Institute of Electrical and Electronics Engineers, Inc. - Low Cost of Ownership scalable copper Direct Bond Interconnect 3D IC technology for three dimensional integrated circuit applications

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Enquist, P. ; Fountain, G. ; Petteway, C. ; Hollingsworth, A. ; Grady, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 6
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306533
Regular:

This paper presents preliminary results of a copper-based Direct Bond Interconnect (DBI®) 3D integration process that has been developed to leverage foundry standard copper dual damascene and... View More

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