IEEE - Institute of Electrical and Electronics Engineers, Inc. - Aluminum-Germanium eutectic bonding for 3D integration

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Crnogorac, F. ; Birringer, R. ; Dauskardt, R. ; Pease, F.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 5
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306531
Regular:

Low-temperature Aluminum-Germanium (Al-Ge) eutectic bonding has been investigated for monolithic three-dimensional integrated circuits (3DIC) applications. Successful bonds using Al-Ge bilayer... View More

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