IEEE - Institute of Electrical and Electronics Engineers, Inc. - Junction-level thermal extraction and simulation of 3DICs

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Melamed, S. ; Thorolfsson, T. ; Srinivasan, A. ; Cheng, E. ; Franzon, P. ; Davis, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 7
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306529
Regular:

In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the majority of active devices... View More

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