IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Fukushima, T. ; Iwata, E. ; Tanaka, T. ; Koyanagi, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 4
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306524
Regular:

We developed a new self-assembled die bonder to produce three-dimensionally integrated circuit (3D IC) using a multichip-to-wafer bonding method in batch. In the self-assembled multichip bonder,... View More

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