IEEE - Institute of Electrical and Electronics Engineers, Inc. - Robust verification of 3D-ICs: Pros, cons and recommendations

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): Hogan, M. ; Petranovic, D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 6
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306522
Regular:

A robust verification methodology for 3D-IC design is presented. This approach addresses the challenge of delivering a familiar verification solution with minimal disruption to existing design and... View More

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