IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design tools for the 3D roadmap

2009 IEEE International Conference on 3D System Integration (3DIC)

Author(s): McIlrath, L. ; Ahmed, W. ; Yip, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: San Francisco, CA, USA, USA
Conference Date: 28 September 2009
Page(s): 1 - 4
ISBN (CD): 978-1-4244-4512-7
ISBN (Paper): 978-1-4244-4511-0
DOI: 10.1109/3DIC.2009.5306521
Regular:

3D TSV technology will soon be widely available and consumer products with embedded TSVs will be the norm rather than the exception. The roadmap envisioned by most for 3D development shows CMOS... View More

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