IEEE - Institute of Electrical and Electronics Engineers, Inc. - A 60GHz LC-VCO module using flip-chip on a laminate substrate

2009 European Microwave Integrated Circuits Conference (EuMIC)

Author(s): Notten, M. ; Veenstra, H. ; Huang, X. ; Mills, J.B.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: Rome, Italy, Italy
Conference Date: 28 September 2009
Page(s): 415 - 418
ISBN (Paper): 978-1-4244-4749-7
Regular:

For emerging mm-wave consumer applications such as high data-rate wireless communications at 60GHz and car radar at 76-81GHz, it is important to investigate the impact of module assembly on IC... View More

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