IEEE - Institute of Electrical and Electronics Engineers, Inc. - Wafer Scale Package construction and usage for RF through millimeter wave applications

2009 European Microwave Integrated Circuits Conference (EuMIC)

Author(s): Morkner, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2009
Conference Location: Rome, Italy, Italy
Conference Date: 28 September 2009
Page(s): 419 - 422
ISBN (Paper): 978-1-4244-4749-7
Regular:

WSP (Wafer Scale Packaging) has come on the market for commercial applications in 2008. But how is a WSP constructed and what are its advantages over traditional surface mount techniques? This... View More

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