IEEE - Institute of Electrical and Electronics Engineers, Inc. - Wafer Scale Package construction and usage for RF through millimeter wave applications
2009 European Microwave Integrated Circuits Conference (EuMIC)
Author(s): | Morkner, H. |
Publisher: | IEEE - Institute of Electrical and Electronics Engineers, Inc. |
Publication Date: | 1 September 2009 |
Conference Location: | Rome, Italy, Italy |
Conference Date: | 28 September 2009 |
Page(s): | 419 - 422 |
ISBN (Paper): | 978-1-4244-4749-7 |
Regular:
WSP (Wafer Scale Packaging) has come on the market for commercial applications in 2008. But how is a WSP constructed and what are its advantages over traditional surface mount techniques? This... View More