IEEE - Institute of Electrical and Electronics Engineers, Inc. - Determination of the repose angle of stuff in rotary kiln based on imaging processing

2009 9th International Conference on Electronic Measurement & Instruments (ICEMI)

Author(s): He, M. ; Zhang, J. ; Liu, X.Y.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2009
Conference Location: Beijing, China, China
Conference Date: 16 August 2009
ISBN (CD): 978-1-4244-3864-8
ISBN (Paper): 978-1-4244-3863-1
DOI: 10.1109/ICEMI.2009.5274754
Regular:

The repose angle of materials in rotary kiln is an important parameter to describe stuff's motion which reflects the quality of stuff sinter indirectly. In this paper, a novel method, using... View More

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