IEEE - Institute of Electrical and Electronics Engineers, Inc. - Measurements on mechanical properties of boron-doped silicon materials for micro inertia sensor

2009 9th International Conference on Electronic Measurement & Instruments (ICEMI)

Author(s): Haipeng Liu ; Shiqiao Gao ; Shaohua Niu ; Lei Jin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2009
Conference Location: Beijing, China, China
Conference Date: 16 August 2009
ISBN (CD): 978-1-4244-3864-8
ISBN (Paper): 978-1-4244-3863-1
DOI: 10.1109/ICEMI.2009.5274601
Regular:

The capacitive structure of comb capacitive micromachined gyroscope is a kind of important structure. The mechanical properties of micro inertia sensor material had changed when the structures... View More

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