IEEE - Institute of Electrical and Electronics Engineers, Inc. - T g : The glass door to photonic devices and integrated circuits

2009 11th International Conference on Transparent Optical Networks (ICTON)

Author(s): Seddon, A.B. ; Lian, Z.G. ; Pan, W.J. ; Furniss, D. ; Benson, T.M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2009
Conference Location: Ponta Delgada, Portugal, Portugal
Conference Date: 28 June 2009
Page(s): 1 - 4
ISBN (CD): 978-1-4244-4826-5
ISBN (Paper): 978-1-4244-4825-8
ISBN (Online): 978-1-4244-4827-2
DOI: 10.1109/ICTON.2009.5185197
Regular:

An emerging technology which shows promise for the fabrication of glass photonic integrated circuits (PICs), is sub-micron-scale embossing or imprinting. This approach makes use of Tg (the glass... View More

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