IEEE - Institute of Electrical and Electronics Engineers, Inc. - Investigation of the MeshFree RPIM Solution for a Haptic Sensing Approach to MEMS Design

2009 WRI World Congress on Computer Science and Information Engineering, CSIE

Author(s): Munier, J.-B. ; Laghrouche, O. ; Desmulliez, M.P.Y.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2009
Conference Location: Los Angeles, California USA, USA
Conference Date: 31 March 2009
Volume: 2
Page(s): 97 - 101
ISBN (Paper): 978-0-7695-3507-4
DOI: 10.1109/CSIE.2009.853
Regular:

The specifications required at the design stage for the thermal management of MEMS based on haptic sensing are studied. The use of a meshfree method is proposed for the computation in real time of... View More

Advertisement