IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study on Shear Behavior of Soil-Structure Interface

2009 International Conference on Engineering Computation (ICEC)

Author(s): Wang Wei ; Lu Tinghao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2009
Conference Location: Hong Kong, China, China
Conference Date: 2 May 2009
Page(s): 127 - 130
ISBN (Paper): 978-0-7695-3655-2
DOI: 10.1109/ICEC.2009.55
Regular:

Shear behavior of interface between soil and structure plays an important role in the analysis on soil-structure interaction and in the design of disaster prevention and mitigation engineering. In... View More

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