IEEE - Institute of Electrical and Electronics Engineers, Inc. - Process integration considerations towards 300 mm TSV manufacturing-moving beyond the champion SEM

2009 IEEE International Reliability Physics Symposium (IRPS)

Author(s): Ramaswami, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2009
Conference Location: Montreal, QC, Canada, Canada
Conference Date: 26 April 2009
Page(s): 156
ISBN (CD): 978-1-4244-2889-2
ISBN (Paper): 978-1-4244-2888-5
ISSN (Paper): 1541-7026
DOI: 10.1109/IRPS.2009.5173243
Regular:

Through-silicon via (TSV) will transition to high volume production when end-customer value (as exhibited by functionality, performance, form factor, etc) are delivered at equivalent yield and... View More

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