IEEE - Institute of Electrical and Electronics Engineers, Inc. - Interpolation to C1 boundary conditions by polynomial of degree six

2009 IEEE International Conference on Shape Modeling and Applications (SMI)

Author(s): Caiming Zhang ; Feng Li ; Dongmei Niu ; Xingqiang Yang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2009
Conference Location: Beijing, China, China
Conference Date: 26 June 2009
Page(s): 126 - 131
ISBN (CD): 978-1-4244-4070-2
ISBN (Paper): 978-1-4244-4069-6
DOI: 10.1109/SMI.2009.5170173
Regular:

A new method for constructing triangular patches to pass the C1 interpolation conditions (boundary curves and cross-boundary slopes), on the boundary of triangles is presented. The... View More

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