IEEE - Institute of Electrical and Electronics Engineers, Inc. - Multilayer silicon RF system-in-package technique using magnetically aligned anisotropic conductive adhesive

2009 IEEE MTT-S International Microwave Symposium Digest (MTT)

Author(s): Sungwook Moon ; Khanna, S.K. ; Chappell, W.J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2009
Conference Location: Boston, MA, USA, USA
Conference Date: 7 June 2009
Page(s): 797 - 800
ISBN (CD): 978-1-4244-2804-5
ISBN (Paper): 978-1-4244-2803-8
ISSN (Paper): 0149-645X
DOI: 10.1109/MWSYM.2009.5165817
Regular:

In this work, we propose a novel packaging concept for highly-integrated RF systems using a magnetically aligned Z-axis anisotropic conductive adhesive. We demonstrate the ability to "grow"... View More

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