IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effective die-package-PCB co-design methodology and its deployment in 10 Gbps serial link transceiver FPGA packages

2009 IEEE MTT-S International Microwave Symposium Digest (MTT)

Author(s): Xiaohong Jiang ; Hong Shi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2009
Conference Location: Boston, MA, USA, USA
Conference Date: 7 June 2009
Page(s): 793 - 796
ISBN (CD): 978-1-4244-2804-5
ISBN (Paper): 978-1-4244-2803-8
ISSN (Paper): 0149-645X
DOI: 10.1109/MWSYM.2009.5165816
Regular:

This paper discusses the die-package-PCB co-design methodology and proposes an effective modeling technique for package-PCB co-simulation. This technique accurately takes into account the... View More

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