IEEE - Institute of Electrical and Electronics Engineers, Inc. - Liquid metal vertical interconnects for RF flip-chip assembly

2009 IEEE MTT-S International Microwave Symposium Digest (MTT)

Author(s): Wood, J. ; Vummidi, K. ; Ralston, P. ; Lihan Chen ; Barker, N.S. ; Raman, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2009
Conference Location: Boston, MA, USA, USA
Conference Date: 7 June 2009
Page(s): 461 - 464
ISBN (CD): 978-1-4244-2804-5
ISBN (Paper): 978-1-4244-2803-8
ISSN (Paper): 0149-645X
DOI: 10.1109/MWSYM.2009.5165733
Regular:

This paper describes a new process for using room temperature liquid metals as the interconnect material for flip chip bonding. The proposed liquid metal interconnects are not susceptible to... View More

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