IEEE - Institute of Electrical and Electronics Engineers, Inc. - Hybrid telemetric MEMS for high temperature measurements into harsh industrial environments

2009 IEEE Intrumentation and Measurement Technology Conference (I2MTC)

Author(s): D Marioli ; E Sardini ; M Serpelloni ; B Ando ; S Baglio ; N Savalli ; C Trigona
Sponsor(s): IEEE Instrum. Meas. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2009
Conference Location: Singapore, Singapore
Conference Date: 5 May 2009
Page(s): 1,423 - 1,428
ISBN (CD): 978-1-4244-3353-7
ISBN (Paper): 978-1-4244-3352-0
ISSN (Paper): 1091-5281
DOI: 10.1109/IMTC.2009.5168678
Regular:

A temperature sensor that could be interrogated contactless represents an attractive solution for measurements into harsh environments such as in presence of high temperatures that do not permit... View More

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