IEEE - Institute of Electrical and Electronics Engineers, Inc. - Through Silicon Via stress characterization

2009 IEEE International Conference on IC Design and Technology (ICICDT)

Author(s): Thuy Dao ; Triyoso, D.H. ; Petras, M. ; Canonico, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2009
Conference Location: Austin, TX, USA, USA
Conference Date: 18 May 2009
Page(s): 39 - 41
ISBN (Paper): 978-1-4244-2933-2
ISBN (Online): 978-1-4244-2934-9
DOI: 10.1109/ICICDT.2009.5166260
Regular:

In this paper, we will present Micro Raman stress data of Through Silicon Vias (TSV) with different shapes and sizes & spacing, and discuss design considerations.

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