IEEE - Institute of Electrical and Electronics Engineers, Inc. - Lead-free soldering of telecommunication network infrastructure products

2009 IEEE International Symposium on Sustainable Systems and Technology (ISSST)

Author(s): Eriksson, B. ; Trankell, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2009
Conference Location: Tempe, AZ, USA, USA
Conference Date: 18 May 2009
Page(s): 1 - 7
ISBN (Paper): 978-1-4244-4324-6
DOI: 10.1109/ISSST.2009.5156736
Regular:

Ericsson has successfully transferred to lead-free solder for its high volume telecom network infrastructure products. By implementing measures for lead-free soldering in all stages of the product... View More

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