IEEE - Institute of Electrical and Electronics Engineers, Inc. - A method to reuse fiber-reinforced waste from e-waste as filler for polymeric composite

2009 IEEE International Symposium on Sustainable Systems and Technology (ISSST)

Author(s): Duan, H. ; Jia, W. ; Li, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2009
Conference Location: Tempe, AZ, USA, USA
Conference Date: 18 May 2009
Page(s): 1
ISBN (Paper): 978-1-4244-4324-6
DOI: 10.1109/ISSST.2009.5156715
Regular:

TREPREG materials (PM) which are reclaimed from waste printed circuit boards industry was used to produce polymeric composites by an extrusion and injection process through adding polypropylene... View More

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