IEEE - Institute of Electrical and Electronics Engineers, Inc. - The promise and implementation of three dimensional integration

2009 International Symposium on VLSI Technology, Systems, and Applications (VLSI-TSA)

Author(s): Iyer, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2009
Conference Location: Hsinchu, Taiwan, Taiwan
Conference Date: 27 April 2009
Page(s): 118
ISBN (CD): 978-1-4244-2785-7
ISBN (Paper): 978-1-4244-2784-0
ISSN (Paper): 1930-885X
DOI: 10.1109/VTSA.2009.5159318
Regular:

In many ways, three dimensional integration presents itself as a logical extension of planar monolithic integration - integration of additional function on the same die. Notwithstanding the... View More

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