IEEE - Institute of Electrical and Electronics Engineers, Inc. - Status and challenges of extreme-UV lithography

2009 International Symposium on VLSI Technology, Systems, and Applications (VLSI-TSA)

Author(s): Ronse, K. ; Hendrickx, E. ; Goethals, M. ; Jonckheere, R. ; Vandenberghe, G.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2009
Conference Location: Hsinchu, Taiwan, Taiwan
Conference Date: 27 April 2009
Page(s): 98 - 99
ISBN (CD): 978-1-4244-2785-7
ISBN (Paper): 978-1-4244-2784-0
ISSN (Paper): 1930-885X
DOI: 10.1109/VTSA.2009.5159309
Regular:

In this paper, the experiences on full field EUVL lithography are reviewed. Besides the imaging performance of the EUV ADT at IMEC, also the progress in resists and reticles are discussed and... View More

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