IEEE - Institute of Electrical and Electronics Engineers, Inc. - A novel modular smart PIC technology platform for functional diversification

2009 21st International Symposium on Power Semiconductor Devices & IC's (ISPSD)

Author(s): Jun Cai ; Szendrei, L. ; Caron, D. ; Park, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2009
Conference Location: Barcelona, Spain, Spain
Conference Date: 14 June 2009
Page(s): 196 - 199
ISBN (CD): 978-1-4244-4673-5
ISBN (Paper): 978-1-4244-3525-8
ISSN (Paper): 1943-653X
DOI: 10.1109/ISPSD.2009.5158035
Regular:

Toward great flexibility in making advanced analog interfaces, a novel modular smart PIC technology platform for functional diversification is proposed. This technology platform offers high... View More

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