IEEE - Institute of Electrical and Electronics Engineers, Inc. - Interconnection failure caused by bath degradation in copper electroplating and its VM-FDC using mathematical model

2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2009)

Author(s): S.-I. Imai ; M. Kitabata ; T. Tanaka
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2009
Conference Location: Berlin, Germany
Conference Date: 10 May 2009
Page(s): 254 - 258
ISBN (CD): 978-1-4244-3615-6
ISBN (Paper): 978-1-4244-3614-9
ISSN (Electronic): 2376-6697
ISSN (Paper): 1078-8743
DOI: 10.1109/ASMC.2009.5155995
Regular:

This paper describes a copper interconnection failure in a damascene process of a system on chip (SoC) caused by the plating bath degradation in copper electroplating equipment. By... View More

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