IEEE - Institute of Electrical and Electronics Engineers, Inc. - SACVD clean investigation with a new calorimetric probe sensor

2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2009)

Author(s): T. Kunstmann ; S. Paulus ; Ing-Shin Chen ; H. Auer ; Lin Feng ; R. Chism ; J.F. Roeder
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2009
Conference Location: Berlin, Germany
Conference Date: 10 May 2009
Page(s): 155 - 160
ISBN (CD): 978-1-4244-3615-6
ISBN (Paper): 978-1-4244-3614-9
ISSN (Electronic): 2376-6697
ISSN (Paper): 1078-8743
DOI: 10.1109/ASMC.2009.5155974
Regular:

Doped and undoped SACVD recipes were investigated with respect to their clean performance with a new calorimetric probe sensor. Endpoint curves were collected with a standalone software utility,... View More

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