IEEE - Institute of Electrical and Electronics Engineers, Inc. - Localized statistical 3D thermal analysis considering Electro-Thermal coupling

2009 IEEE International Symposium on Circuits and Systems (ISCAS)

Author(s): Zuying Luo ; J. Fan ; S.X.-D. Tan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2009
Conference Location: Taipei, Taiwan
Conference Date: 24 May 2009
Page(s): 1,289 - 1,292
ISBN (CD): 978-1-4244-3828-0
ISBN (Paper): 978-1-4244-3827-3
ISSN (Electronic): 2158-1525
ISSN (Paper): 0271-4302
DOI: 10.1109/ISCAS.2009.5117999
Regular:

In this paper, we propose a novel method for analyzing fewer hot spots in a chip. The method, called SNSOR (single-node successive over relaxation), is based on a novel localized relaxed iterative... View More

Advertisement