IEEE - Institute of Electrical and Electronics Engineers, Inc. - Novel coils topology intended for biomedical implants with multiple carrier inductive link

2009 IEEE International Symposium on Circuits and Systems - ISCAS 2009

Author(s): G. Simard ; M. Sawan ; D. Massicotte
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2009
Conference Location: Taipei, Taiwan
Conference Date: 24 May 2009
Page(s): 537 - 540
ISBN (CD): 978-1-4244-3828-0
ISBN (Paper): 978-1-4244-3827-3
ISSN (Electronic): 2158-1525
ISSN (Paper): 0271-4302
DOI: 10.1109/ISCAS.2009.5117804
Regular:

Biomedical implants require wireless power and bidirectional data transfer. We propose a novel topology for a multiple carrier inductive link and compare two geometries for it. The orthogonal... View More

Advertisement