IEEE - Institute of Electrical and Electronics Engineers, Inc. - Interconnection with copper pillar bumps : Process and applications

2009 IEEE International Interconnect Technology Conference - IITC

Author(s): Lee, C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2009
Conference Location: Sapporo, Japan, Japan
Conference Date: 1 June 2009
Page(s): 214 - 216
ISBN (CD): 978-1-4244-4493-9
ISBN (Paper): 978-1-4244-4492-2
DOI: 10.1109/IITC.2009.5090391
Regular:

Flipchip technologies have been evolved to grab the major portion of the high and medium performance markets, where the bump interconnections are required. Bumps can be diverse in their contents,... View More

Advertisement