IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps

2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

Author(s): Orii, Y. ; Toriyama, K. ; Noma, H. ; Oyama, Y. ; Nishiwaki, H. ; Ishida, M. ; Nishio, T. ; LaBianca, N.C. ; Feger, C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2009
Conference Location: San Diego, CA, USA, USA
Conference Date: 26 May 2009
Page(s): 948 - 953
ISBN (CD): 978-1-4244-4476-2
ISBN (Paper): 978-1-4244-4475-5
ISSN (Paper): 0569-5503
DOI: 10.1109/ECTC.2009.5074127
Regular:

PoP structures have been used widely in digital consumer electronics products such as digital still cameras and mobile phones. However, the final stack height from the top to the bottom package... View More

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