IEEE - Institute of Electrical and Electronics Engineers, Inc. - Influence of thermal ageing on long term reliability of SnAgCu solder joints

2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Author(s): Dompierre, B. ; Aubin, V. ; Charkaluk, E. ; Maia Filho, W. C. ; Brizoux, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2009
Conference Location: Delft, The Netherlands, The Netherlands
Conference Date: 26 April 2009
Page(s): 1 - 6
ISBN (CD): 978-1-4244-4161-7
ISBN (Paper): 978-1-4244-4160-0
DOI: 10.1109/ESIME.2009.4938473
Regular:

Reliability of SnAgCu solder joints under mechanical stress is not proven, in particular for Aeronautic and High Performance (AHP) products. They are subjected to high temperatures, severe... View More

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