IEEE - Institute of Electrical and Electronics Engineers, Inc. - Prediction of the thermo-mechanical material behavior of PEN foil during photolithographic processing

2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Author(s): Barink, M. ; Goorhuis, M. ; Giesen, P. ; Furthner, F. ; Yakimets, I.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2009
Conference Location: Delft, The Netherlands, The Netherlands
Conference Date: 26 April 2009
Page(s): 1 - 4
ISBN (CD): 978-1-4244-4161-7
ISBN (Paper): 978-1-4244-4160-0
DOI: 10.1109/ESIME.2009.4938444
Regular:

Flexible substrates (polymers) for plastic electronic products are far less stable to environmental factors, like heat and moisture, than currently used non-flexible substrates (silicon). This... View More

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