IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design and implementation of a inter-chip bridge in a Multi-core SoC

2009 4th International Conference on Design & Technology of Integrated Systems in Nanoscal Era (DTIS)

Author(s): Yaming Yin ; Shuming Chen
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2009
Conference Location: Cairo, Egypt, Egypt
Conference Date: 6 April 2009
Page(s): 102 - 106
ISBN (CD): 978-1-4244-4321-5
ISBN (Paper): 978-1-4244-4320-8
DOI: 10.1109/DTIS.2009.4938034
Regular:

Single-core DSP becomes more and more difficult to meet the demand of some application-specific fields, such as 3G mobile communication, consumer electronic systems and intelligent control... View More

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