IEEE - Institute of Electrical and Electronics Engineers, Inc. - A reliability test on PBGA packaging through piezoresistive stress sensor

2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (MEMS/MOEMS)

Author(s): Liu, C.H. ; Chung, H. ; Yang, D.W. ; Tseng, K.F. ; Lwo, B.J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2009
Conference Location: Rome, Italy, Italy
Conference Date: 1 April 2009
Page(s): 47 - 50
ISBN (Paper): 978-1-4244-3874-7
Regular:

Plastic packaging is the mainstream on microelectronic packaging technology at present. As the continuous requirements for smaller but higher density products, failure and reliability issues on... View More

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