IEEE - Institute of Electrical and Electronics Engineers, Inc. - Waste reduction of returnable packaging: A case study of reverse logistics in an auto parts company

2015 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)

Author(s): N. Katephap ; S. Limnararat
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2015
Conference Location: Singapore, Singapore
Conference Date: 6 December 2015
Page(s): 1,598 - 1,602
ISBN (Electronic): 978-1-4673-8066-9
ISBN (USB): 978-1-4673-8065-2
DOI: 10.1109/IEEM.2015.7385917
Regular:

The objective of this research is to study and reduce waste of reverse logistics in an auto parts company. The result of this study shows that the main problem of packaging waste for packing auto... View More

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