IEEE - Institute of Electrical and Electronics Engineers, Inc. - Improving Overall Equipment Effectiveness (OEE) through integration of Maintenance Failure Mode and Effect Analysis (maintenance-FMEA) in a semiconductor manufacturer: A case study

2015 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)

Author(s): K. E. Chong ; K. C. Ng ; G. G. G. Goh
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2015
Conference Location: Singapore, Singapore
Conference Date: 6 December 2015
Page(s): 1,427 - 1,431
ISBN (Electronic): 978-1-4673-8066-9
ISBN (USB): 978-1-4673-8065-2
DOI: 10.1109/IEEM.2015.7385883
Regular:

In order to continue survive in today's competitive business environment, the key to success for many manufacturing companies is productivity. In response to the external pressure of global... View More

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