IEEE - Institute of Electrical and Electronics Engineers, Inc. - Improving Overall Equipment Effectiveness (OEE) through integration of Maintenance Failure Mode and Effect Analysis (maintenance-FMEA) in a semiconductor manufacturer: A case study
2015 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)
Author(s): | K. E. Chong ; K. C. Ng ; G. G. G. Goh |
Publisher: | IEEE - Institute of Electrical and Electronics Engineers, Inc. |
Publication Date: | 1 December 2015 |
Conference Location: | Singapore, Singapore |
Conference Date: | 6 December 2015 |
Page(s): | 1,427 - 1,431 |
ISBN (Electronic): | 978-1-4673-8066-9 |
ISBN (USB): | 978-1-4673-8065-2 |
DOI: | 10.1109/IEEM.2015.7385883 |
Regular:
In order to continue survive in today's competitive business environment, the key to success for many manufacturing companies is productivity. In response to the external pressure of global... View More