IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design and simulation of Tri-morph based MEMS thermal sensor for harsh environment

2015 International Conference on Computer, Communication and Control (IC4)

Author(s): Manoj Kumar Sonker
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2015
Conference Location: Indore, India
Conference Date: 10 September 2015
Page(s): 1 - 7
ISBN (CD): 978-1-4799-8163-2
ISBN (Electronic): 978-1-4799-8164-9
DOI: 10.1109/IC4.2015.7375529
Regular:

Cantilever beam is an important basic structure of micro-electro-mechanical system thermal devices. Tri-morph cantilever beam is a combination of three metals or composites bonded in stack.... View More

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