IEEE - Institute of Electrical and Electronics Engineers, Inc. - Towards a quantitative methodology for measuring micro and nanoscale transition properties for heat transfer modelling in thermal devices and materials

2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Author(s): Angela Dawson ; Antony S. Maxwell
Sponsor(s): IEEE
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2015
Conference Location: Paris, France
Conference Date: 30 September 2015
Page(s): 1 - 6
ISBN (Electronic): 978-1-4673-9705-6
DOI: 10.1109/THERMINIC.2015.7389642
Regular:

A first uncertainty budget for Scanning Thermal Microscopy (SThM) is developed because quantitative data is needed to accurately model heat transfer behaviour of polymers and polymeric components.... View More

Advertisement