IEEE - Institute of Electrical and Electronics Engineers, Inc. - Simulation of film structures for CMOS image sensors

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Author(s): Kuo-Tsai Wu ; Sheng-Jye Hwang ; Wei-Min Tsai
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2015
Conference Location: Taipei, Taiwan
Conference Date: 21 October 2015
Page(s): 365 - 368
ISBN (Electronic): 978-1-4673-8356-1
ISBN (USB): 978-1-4673-8355-4
ISBN (Paper): 978-1-4673-9690-5
DOI: 10.1109/IMPACT.2015.7365252
Regular:

This study will use ANSYS, the commercial finite element analysis software, to simulate the thin film stacked in different processes on CMOS image sensors. For example, the process of color filter... View More

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