IEEE - Institute of Electrical and Electronics Engineers, Inc. - A novel concept for RF-system-in-package high volume production measurements

2015 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS)

Author(s): Ariel Rosenberg ; Nadav Buadana ; Amir Lin ; Roni Livney
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2015
Conference Location: Tel-Aviv, Israel
Conference Date: 2 November 2015
Page(s): 1 - 4
ISBN (Electronic): 978-1-4799-7473-3
ISBN (USB): 978-1-4799-7472-6
DOI: 10.1109/COMCAS.2015.7360361
Regular:

Today more and more multifunction RF-SIP (System-In-Package) modules, in SMD (Surface-Mount-Technology) package style, come into high volume production phase. There are many challenges in... View More

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