IEEE - Institute of Electrical and Electronics Engineers, Inc. - Verification of the thin film metal layer thickness by energy dispersive X-ray

2015 IEEE Regional Symposium on Micro- and Nanoelectronics (RSM)

Author(s): Lai Chin Yung ; Cheong Choke Fei
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2015
Conference Location: Kuala Terengganu, Malaysia
Conference Date: 19 August 2015
Page(s): 1 - 4
ISBN (Electronic): 978-1-4799-8550-0
ISBN (USB): 978-1-4799-8549-4
DOI: 10.1109/RSM.2015.7355004
Regular:

Leadframe fabrication process normally involves additional thin film metal layer plating on the bulk copper substrate surface for wire bond purpose. The recent commonly adopted plating materials... View More

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