IEEE - Institute of Electrical and Electronics Engineers, Inc. - Improved adhesion for plated Solar cell metallisation

2015 IEEE 42nd Photovoltaic Specialists Conference (PVSC)

Author(s): C. M. Chong ; A. Wenham ; R. Chen ; S. Wang ; J. Ji ; Z. Shi ; L. Mai ; B. Tjahjono ; B. Hallam ; A. Sugianto ; S. Wenham
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2015
Conference Location: New Orleans, LA, USA
Conference Date: 14 June 2015
Page(s): 1 - 4
ISBN (Electronic): 978-1-4799-7944-8
ISBN (DVD): 978-1-4799-7943-1
DOI: 10.1109/PVSC.2015.7355882
Regular:

Experts predict that copper plated metal contacts will eventually become the dominant metallisation for silicon wafer-based technologies once several key issues are solved. Of particular... View More

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