IEEE - Institute of Electrical and Electronics Engineers, Inc. - Heterogenous integration technology using wafer-to-wafer transfer

2015 IEEE International Ultrasonics Symposium (IUS)

Author(s): Shuji Tanaka
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2015
Conference Location: Taipei, Taiwan
Conference Date: 21 October 2015
Page(s): 1 - 5
ISBN (Electronic): 978-1-4799-8182-3
ISBN (DVD): 978-1-4799-8181-6
DOI: 10.1109/ULTSYM.2015.0136
Regular:

The integration of heterogeneous components and materials is a powerful method to create more functional, higher performance and/or smaller devices. A typical example is the integration of a... View More

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