IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fabrication, assembly, failure estimations of for ultra-thin chips stacking by using pre-molding technology

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

Author(s): Chang-Chun Lee ; Yu-Min Lin ; Yan-Yu Liou ; Chau-Jie Zhan ; Tao-Chih Chang
Sponsor(s): IEEE Electron Dev. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2015
Conference Location: Grenoble, France
Conference Date: 18 May 2015
Page(s): 237 - 240
ISBN (Electronic): 978-1-4673-7356-2
ISBN (USB): 978-1-4673-7355-5
DOI: 10.1109/IITC-MAM.2015.7325659
Regular:

To overcome the severe challenges of achieving an extra-thin thickness down to 10 μm for chip stacking of 3D-IC module such as the mechanical damages appear at chip grinding, subsequent steps... View More

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