IEEE - Institute of Electrical and Electronics Engineers, Inc. - Copper-copper direct bonding: Impact of grain size

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

Author(s): P. Gondcharton ; B. Imbert ; L. Benaissa ; M. Verdier
Sponsor(s): IEEE Electron Dev. Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2015
Conference Location: Grenoble, France
Conference Date: 18 May 2015
Page(s): 229 - 232
ISBN (Electronic): 978-1-4673-7356-2
ISBN (USB): 978-1-4673-7355-5
DOI: 10.1109/IITC-MAM.2015.7325657
Regular:

In recent years, a great interest has emerged in the development of new wafer-scale assembly processes. Beside the mechanical strength required, some applications need a vertical conductivity... View More

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